Product Description: Product Description: The Printed Circuit Assembly product is enables the product to have a high circuit density and reduced size. This feature is particularly useful for customers who require smaller ...learn more
Printed Circuit Assembly With LF HAL 4 Layer PCB SMT/DIP Service Impedance Control

Printed Circuit Assembly With LF HAL 4 Layer PCB SMT/DIP Service Impedance Control
1-2 weeks
Negotiation
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GT SMART (Changsha) Technology Co., Limited

Verified Supplier
3 Years
Replace a batch

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